Hand us the brief. Get a study.

When the geometry is too large for the cloud quota, the bench is too custom for the presets, or the deadline is too short for in-house iteration — fill the brief and we run the study end to end.

Send the brief

Closed form

Biot–Savart and Neumann solver

100³

volumetric resolution

3 weeks

typical turnaround

NDA

signed before any handover

Your name*Work email*

OrganisationApplication area*

Target envelope

Transferred powerOperating frequency — kHz, MHz, or 'flexible'

Air gap (TX → RX) — mm or rangeFootprint constraint — diameter or W × H

Project shape

Timeline / deadlineIndicative budget

Hardware constraints — ferrite, copper class, fab process, thermal envelopeAnything else we should know — what you've tried, what's failed, what's non-negotiableI'd like to sign an NDA before sharing technical detail.

Replies within one business day.

What happens between brief and delivery

BriefDay 0
Form arrives. We reply within one business day to scope hours and price.
SweepWeek 1
Parameter sweep across candidate topologies; weekly written check-in.
GAWeek 2
Genetic optimiser converges. NSGA-II Pareto front when objectives compete.
ValidateWeek 3
Check the result against the closed-form references and state where the air-core model stops.
DeliverWeek 3-4
Typeset PDF, KiCad footprint, DXF, SPICE netlist, raw .airinduct session.

What you get back: four artifacts, one study

PDF

Typeset report

Methods, assumptions, sweep, optimiser convergence, validation envelope.

CAD

KiCad + DXF

PCB footprint (.kicad_mod) and 2D outline ready for downstream CAD.

SPICE

Netlist

L · M · k component values for circuit-level simulation.

RAW

.airinduct session

Your team can keep iterating in the app after handover.

Or talk it through first.

Book an intro call Try the simulator